Enabling tangible technologies

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Taking tangible technologies a step further.

Innovation in ELT Group means enabling tangible technologies with a clear goal in mind: offering practical solutions that will ensure people’s safety in a forward thinking way.

OUR TECHNOLOGIES

High Power Generation RF/EO

Innovation in power generation in our radio frequency (RF) and infrared (IR) countermeasure systems follows the significant advancements of Gallium Nitride GaN technology and Quantum Cascade Laser QCL in the RF field. In both cases, devices based on these innovative technologies are achieving an optimal balance of performance, energy efficiency, small size and reliability, at an increasingly attractive cost.

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OUR TECHNOLOGIES

Advanced materials

High frequency materials are the basis for EM routing and manipulation. We are involved in the development of advanced technologies and solution, with the aim to reach outstanding performances in both SWaP&C reduction and to get unique RF performances or for implementing new properties – non achievable using “standard” materials.
Our metamaterials are made up of a collection of tiny scatterers – called “inclusions” – whose separation is much less than the wavelength of operation. A proper design of such inclusions can bring to new synthetic properties that allow to design a new class of components.

OUR TECHNOLOGIES

Solutions for thermal management

Data processing capability by modern electronic technology has hardware design limits, lying in the challenge presented by thermal management. Thus, according to the main parameters that come into play when designing thermally robust units, our solutions may employ a wide range of technologies, including but not limited to phase change material heat exchangers, heat transfer enhancement by heat pipes and additive manufactured cold plates. On the other hand, when it comes to conditioning the main coolant, our designs range from simple but effective pumped liquid loops, to vapor compression solutions, to air-cycle systems when no electric power is available, and finally to the most advanced integrated combinations of power generation and thermal management.            

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OUR TECHNOLOGIES

SWAP technologies

Technology advancements will enable new missions to be performed by increasingly smaller, lower cost platforms. To fulfill these needs, it is mandatory to realize modular systems that meet SWaP requirements (Size, Weight and Power), reducing the overall dimensions and weight of items while increasing their efficiency and lowering the overall footprint. We are currently adopting cutting-edge technologies to integrate lighter, smaller and more compact devices, such as Direct Sampling, System on Chip and System In Package.

DIGITAL ENGINEERING

Our approach to Digital Engineering

Successful innovations are based on successful models. Discover more about ours.